About

Building a stable high-performance computer requires strict adherence to electrical and mechanical standards. This V2 Upgrade of the Platform-First Configurator expands the compatibility matrix to cover a comprehensive range of modern hardware, ensuring that the motherboard - the system's backbone - is perfectly matched to the processor and memory.

The core of this tool is the VRM (Voltage Regulator Module) Analysis Engine. Modern CPUs, such as the Intel Core i9 or AMD Ryzen 9, exhibit aggressive transient power spikes. A motherboard with weak power stages (measured in Amps) will thermally saturated, forcing the CPU to downclock (throttle). This tool calculates the Electrical Compatibility Score by comparing the motherboard's power phase delivery against the CPU's PL2 (Short Duration Power Limit).

Furthermore, V2 introduces Memory Controller Synergy checks. It analyzes whether the selected RAM speed exceeds the CPU's native memory controller capabilities, indicating the need for XMP/EXPO profiles, and assesses the platform's upgrade potential.

Formulas

The comprehensive analysis relies on three key vectors: Total System Power, VRM Thermal Headroom, and Memory Controller Load.

{

Power_max = (TDP_cpu × 1.35) + P_board + (n_dimm × 7)VRM_score = Current_{mobo_max}Current_{cpu_peak}Mem_ratio = Freq_ramFreq_{cpu_native}

If VRM_score < 1.0, the system is at risk of throttling. If Mem_ratio > 1.0, the user must enable XMP/EXPO in BIOS to achieve advertised speeds.

Reference Data

Chipset	Socket	Architecture	PCIe Lanes (Gen5/4/3)	Mem Support	VRM Topology (Typ)
Z790	LGA1700	Intel 12/13/14th	20 (CPU) + 28 (PCH)	DDR4 or DDR5	20+1+2 (90A)
H770	LGA1700	Intel 12/13/14th	16 (CPU) + 16 (PCH)	DDR4 or DDR5	14+1+1 (60A)
B760	LGA1700	Intel 12/13/14th	16 (CPU) + 10 (PCH)	DDR4 or DDR5	12+1+1 (60A)
H610	LGA1700	Intel 12/13/14th	16 (CPU)	DDR4 Only	6+1+1 (Discrete)
X670E	AM5	AMD Ryzen 7000/8000	24 (CPU) + 20 (PCH)	DDR5 Only	18+2+2 (105A)
X670	AM5	AMD Ryzen 7000/8000	24 (CPU) + 20 (PCH)	DDR5 Only	16+2+2 (80A)
B650E	AM5	AMD Ryzen 7000/8000	24 (CPU) + 12 (PCH)	DDR5 Only	16+2+1 (80A)
B650	AM5	AMD Ryzen 7000/8000	24 (CPU) + 8 (PCH)	DDR5 Only	12+2+1 (60A)
A620	AM5	AMD Ryzen 7000/8000	24 (CPU)	DDR5 Only	8+2+1 (50A)
X570S	AM4	AMD Ryzen 3000/5000	24 (CPU) + 16 (PCH)	DDR4 Only	14+2 (90A)
B550	AM4	AMD Ryzen 3000/5000	20 (CPU) + 10 (PCH)	DDR4 Only	10+2 (50A)

Frequently Asked Questions

CPU lanes connect directly to the processor, offering the lowest latency and highest bandwidth (crucial for GPUs and primary NVMe drives). Chipset (PCH) lanes act as a hub, sharing a single uplink to the CPU, suitable for secondary storage, USB, and networking.

This appears when your selected RAM speed is significantly higher than the CPU's native support. For example, Intel CPUs often switch to "Gear 2" (half controller speed) above DDR5-6400MHz, which can increase latency despite higher bandwidth.

Often, no. E-ATX boards are wider (typically 12 inches by 10.9 inches) and may block cable grommets or radiator mounts in standard ATX cases. Always check your case's maximum motherboard size specification.

From a longevity standpoint, yes. AMD has committed to supporting the AM5 socket through 2025+, allowing for future CPU upgrades without changing the motherboard. LGA1700 effectively ended with the 14th Gen Intel series.

Our tiers (S through E) are derived from the total amperage output capability and heatsink mass. Tier S boards use 90A+ Smart Power Stages and fin-stack heatsinks, while Tier E boards often use discrete MOSFETs with no heatsinks, suitable only for low-power office builds.